Printed circuit Corporation pcb manufacturing capacity has been increased, joined the village ENIG/ENEPIG plating, wet-enables customers to specify the end of a conventional immersion gold board finish, or select ENEPIG new plating.
ENEPIG mixed technology Assembly, surface-mount components are integrated on the same PCB and wire bonding equipment excellent display effect of gold. There is a single solution, improves the manufacturing yields of printed circuit boards, soldering joint tensile test and surface mount solder joints at the same time.
Before electrolytic processing, thin gold plating for printed circuit board manufacturing all of the deposits of surface mount pads, to prevent solder embrittlement. Then, they will be re-imaged and galvanised wire bonding of thick deposits of gold fields. In Imaging and plating has suffered from loss of production many times in both open frame manufacture and Assembly.
ENEPIG allows PWB manufacturers through the final finish, has a high degree of reliability on line bonding and surface mount Assembly quality.
"We had a couple ENEPIG with excellent results in two wire tensile strength and high reliability, SMD survivability evaluation of customer, seems to be growing interest in technology, we want to predict customer needs in the future and said," Ken Tannehill, President and Chief Executive Officer. "This new line gives us flexibility provides our partners with either completed. ”
On printed circuit boards
Printed circuit Corporation is a United States manufacturer of multilayer flex and rigid-flex PCB , 36 years of experience, building circuits are typically used in high reliability applications, such as medical, military and commercial electronics, where premium reliability, packaging density and weight.
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